vj 3505 www.vishay.com vishay vitramon revision: 03-mar-15 1 document number: 45158 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vj 3505 uhf chip antenna for mobile devices the companys products are cove red by one or more of the following: ? wo2008250262 (a1), us2008303720 (a1), ? us2008305750 (a1), wo2008154173 (a1). ? other patents pending. description the vj 3505 multi-layer ceramic chip antenna is a small form-factor, high-performance, chip-antenna designed for tv reception in mobile device s in the uhf band. it allows mobile tv device manufactur ers to design high quality products that do not bear the penalty of a large external antenna. utilizing vishay's unique materials and manufacturing technologies, this product complies with the mbrai standard while maintaining a small outline. focusing on consumer applications, the antenna is designed to be assembled onto a pc board in the standard reflow process. target customers of the vj 3505 are mobile phone makers, portable multimedia device makers, notebook oems and odms, and accessory card oems and odms. features ? small outline (35 mm x 5 mm x 1.2 mm) ? omni-directional, linear polarization ? complies with mbrai standard ? complete uhf band coverage (470 mhz to 860 mhz) up to 1.1 ghz ? requires a tuning circuit and ground plane for optimal performance ? standard smt assembly ? 50 ? unbalanced interface ? operating temperature ra nge (-40 c to +85 c) ? reference design and evaluation boards available upon request ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? mobile uhf tv receivers including dvb-t, dvb-h, isdb-t, cmmb, atsc, and mediaflo devices antenna performance peak gain and efficiency the antenna radiation characteristics are influenced by several factors including ground plane dimensions and impedance matching network. the antenna parameters pr esented hereafter were simulated according to the ground plane configuration suggested by the vj 3505 evaluation board. fig 1. shows simulated peak ga in and radiation efficiency over frequency throughout the uhf band, compared with the mbrai requirements. fig. 1 - peak gain and efficiency vs. frequency quick reference data series frequency (mhz) max. gain (dbi) average gain (dbi) VJ3505M011SXMSRA0 470 to 860 -0.5 -1 vj 3505 simulated antenna parameters -12 -10 -8 -6 -4 -2 0 2 frequency (mhz) radiation efficiency (db) 470 520 570 620 670 720 770 820 870 radiation efficiency mbrai peak gain
vj 3505 www.vishay.com vishay vitramon revision: 03-mar-15 2 document number: 45158 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 radiation pattern the 3d planes of vj 3505 are defined in fig 2. fig. 2 - vj 3505 3d plane definition fig 3. displays the simulated 3d radiation pattern at 550 mhz. the general pattern shape does not change with frequency. fig. 3 - simulated radi ation pattern at 550 mhz x z y
vj 3505 www.vishay.com vishay vitramon revision: 03-mar-15 3 document number: 45158 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 4 displays the measured radiation patterns of vj 3505 evalua tion board in the yz plane as de fined in fig. 2. zero degrees is defined at the z axis, stepping clockwise. fig. 4 - measured radiation pattern footprint and mechanical dimensions the antenna footprint and mechan ical dimensions are presented in fig 5. for mechanical support, it is recommended to add one or two drops of heat curing epoxy glue . the glue dot should not overlap with any of the soldering pads. it is recommended to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. for more details see vj 3505 assembly ? guidelines section below. fig. 5 - vj 3505 footprint dimensions (mm) length 35 + 0.5 / - 0 width 5 + 0.5 / - 0 height 1.2 0.1 30 60 90 120 150 180 210 240 270 300 330 0 -10 -20 -50 -40 -30 500 mhz - g ain (dbi) v s . angle () 30 60 90 120 150 180 210 240 270 300 330 0 -10 -20 -50 -40 -30 600 mhz - g ain (dbi) v s . angle () 30 60 90 120 150 180 210 240 270 300 330 0 -20 -50 -40 -30 700 mhz - g ain (dbi) v s . angle () 30 60 90 120 150 180 210 240 270 300 330 0 -10 -20 -50 -40 -30 862 mhz - g ain (dbi) v s . angle () -10 4.5 rf feed connect s here all dimen s ion s in mm figure not in s cale 35 0.25 0.25 1 1 1 9 9 9 1 1 apply glue in thi s area 0.25 0.25 5
vj 3505 www.vishay.com vishay vitramon revision: 03-mar-15 4 document number: 45158 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vj 3505 assembly guidelines 1. mounting of antennas on a printed circuit board should be done by reflow solderin g. the reflow soldering profiles are shown below. 2. in order to provide the adequate streng th between the antenna and the pcb the application of a dot of heat cured epoxy glue in the center of the footprint of the antenna prior to the antennas soldering to the board should be done. an example for such glue could be heraeus pd 860002 sa. the weight of the dot should be 5 mg to 10 mg. fig. 6 - soldering ir reflow with snpb solder fig. 7 - soldering reflow with sn solder time 30 s to 60 s 30 s to 60 s 30 s to 60 s 0 50 100 150 200 250 300 t (c) > 215 c: 20 s to 40 s max. temperature min. temperature sn-pb eutectic solder paste t (s) 0 50 100 150 200 250 300 t (c) 260 c 50 100 150 200 250 245 c 215 c 180 c 130 c 40 s 10 s 10 s 2 k/s ? ?
vj 3505 www.vishay.com vishay vitramon revision: 03-mar-15 5 document number: 45158 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 8 - soldering ir reflow with snagcu solder ordering information vishay material packaging quantity vj 3505 VJ3505M011SXMSRA0 1000 pieces 0 50 100 150 200 250 300 t (c) time 60 s to 120 s 30 s to 60 s max. temperature min. temperature sn-ag-cu solder paste 60 s to 120 s 60 s to 120 s
legal disclaimer notice www.vishay.com vishay revision: 13-jun-16 1 document number: 91000 disclaimer ? all product, product specifications and data ar e subject to change with out notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, representation or guarantee regarding the suitability of th e products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product , (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all implied warranties, includ ing warranties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain types of applicatio ns are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular applic ation. it is the customers responsibility to validate tha t a particular product with the prope rties described in the product sp ecification is suitable for use in a particular application. parameters provided in datasheets and / or specifications may vary in different ap plications and perfor mance may vary over time. all operating parameters, including ty pical parameters, must be va lidated for each customer application by the customer s technical experts. product specifications do not expand or otherwise modify vishays term s and conditions of purchase, including but not limited to the warranty expressed therein. except as expressly indicated in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vishay product could result in personal injury or death. customers using or selling vishay product s not expressly indicated for use in such applications do so at their own risk. please contact authorized vishay personnel to obtain writ ten terms and conditions rega rding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is gran ted by this document or by any conduct of vishay. product names and markings noted herein may be trademarks of their respective owners.
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